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STTH506
Turbo 2 ultrafast - high voltage rectifier
Main product characteristics
K
IF(AV) VRRM Tj VF (typ) trr (max) 5A 600 V 175 C 1.1 V 30 ns
A
K
A NC
DPAK STTH506B
Features and benefits

A K
TO-220AC STTH506D
A K
TO-220FPAC STTH506FP
Ultrafast switching Low reverse current Low thermal resistance Reduces conduction and switching losses Insulated package TO-220FPAC - Insulated voltage: 2500 VRMS - Typical package capacitance: 12 pF
Order codes
Part Number STTH506B STTH506B-TR STTH506D STTH506FP Marking STTH506B STTH506B STTH506D STTH506FP
Description
The STTH506 uses ST Turbo2 600V technology. This device is specially suited for use in switching power supplies, and industrial applications. Table 1.
Symbol VRRM IF(RMS) Repetitive peak reverse voltage
Absolute ratings (limiting values per diode at 25 C, unless otherwise specified)
Parameter Value 600 TO-220AC, TO220FPAC RMS forward current DPAK Average forward current, = 0.5 Tc = 145 C Tc = 120 C tp = 10 ms Sinusoidal TO-220AC, DPAK TO-220FPAC TO-220AC, TO220FPAC DPAK 10 5 5 70 55 -65 to + 175
(1)
Unit V A A A A A A C C
20
IF(AV)
IFSM Tstg Tj
1.
Surge non repetitive forward current Storage temperature range
Maximum operating junction temperature
175
dP tot thermal runaway condition for a diode on its own heatsink 1 -------------- < ------------------------dTj R th ( j - a )
May 2006
Rev 1
www.st.com
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Characteristics
STTH506
1
Table 2.
Characteristics
Thermal parameters
Parameter Junction to case TO-220AC, DPAK TO-220FPAC Value 3.5 6 Unit C/W
Symbol Rth(j-c)
Table 3.
Symbol IR(1) VF(2)
Static electrical characteristics
Parameter Reverse leakage current Forward voltage drop Test conditions Tj = 25 C Tj = 150 C Tj = 25 C Tj = 150 C VR = VRRM IF = 5 A Min. Typ Max. 5 13 1.10 130 1.85 1.40 Unit A V
1. Pulse test: tp = 5 ms, < 2 % 2. Pulse test: tp = 380 s, < 2 %
To evaluate the conduction losses use the following equation: P = 1.07 x IF(AV) + 0.066 IF2(RMS) Table 4.
Symbol
Dynamic characteristics
Parameter Test conditions IF = 0.5 A, Irr = 0.25 A, IR = 1 A, Tj = 25 C IF = 1 A, dIF/dt = -50 A/s, VR = 30 V, Tj = 25 C IF = 5 A, dIF/dt = -100 A/s, VR = 400 V, Tj = 25 C dIF/dt = 100 A/s IF = 5 A VFR = 1.1 x VFmax, Tj = 25 C IF = 5 A dIF/dt = 100 A/s VFR = 1.1 x VFmax, Tj = 25 C 4 35 3.5 Min. Typ Max. 30 ns 50 5 180 ns V Unit
trr
Reverse recovery time
IRM tfr VFP
Reverse recovery current Forward recovery time Forward recovery voltage
Figure 1.
PF(AV)(W)
Conduction losses versus average current
= 0.05 = 0.1 = 0.2 = 0.5
Figure 2.
IFM(A)
Forward voltage drop versus forward current
9 8 7 6 5
100 90 80 70
Tj=150C (maximum values)
=1
60 50
Tj=150C (typical values)
4 40 3 30 20
T
2 1 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Tj=25C (maximum values)
IF(AV)(A)
=tp/T
tp
10 0 0.0 0.5 1.0 1.5 2.0
VFM(V)
2.5 3.0 3.5 4.0
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STTH506
Characteristics
Figure 3.
Relative variation of thermal Figure 4. impedance junction to case versus pulse duration (TO-220AC, DPAK)
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2
Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAC)
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0
Zth(j-c)/Rth(j-c)
Single pulse TO-220AC DPAK
Zth(j-c)/Rth(j-c)
Single pulse TO-220FPAC
tp(s)
1.E-02 1.E-01 1.E+00
0.1 0.0 1.E-03 1.E-02
tp(s)
1.E-01 1.E+00 1.E+01
1.E-03
Figure 5.
IRM(A)
VR=400V Tj=125C
Peak reverse recovery current versus dIF/dt (typical values)
Figure 6.
trr(ns)
Reverse recovery time versus dIF/dt (typical values)
VR=400V Tj=125C
14 12 10 8 6 4
250
IF=2 x IF(AV) IF=IF(AV) IF=0.5 x IF(AV)
200
IF=2 x IF(AV)
150
IF=IF(AV) IF=0.5 x IF(AV)
IF=0.25 x IF(AV)
100
50 2
dIF/dt(A/s)
0 0 50 100 150 200 250 300 350 400 450 500 0 0 50 100 150
dIF/dt(A/s)
200 250 300 350 400 450 500
Figure 7.
Reverse recovery charges versus dIF/dt (typical values)
Figure 8.
Softness factor versus dIF/dt (typical values)
IF = 2 x IF(AV) VR = 400 V Tj = 125 C
350
Qrr(nC)
VR=400V Tj=125C IF=2 x IF(AV)
2.50 2.25 2.00
S factor
300
250
IF=IF(AV)
1.75 200
IF=0.5 x IF(AV)
1.50 1.25 1.00
150
100 0.75
dIF/dt(A/s)
50 0 50 100 150 200 250 300 350 400 450 500 0.50 0 50 100 150
dIF/dt(A/s)
200 250 300 350 400 450 500
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Characteristics
STTH506
Figure 9.
Relative variations of dynamic parameters versus junction temperature
IF=IF(AV) VR=400V Reference: Tj=125C
Figure 10. Transient peak forward voltage versus dIF/dt (typical values)
26 24 22 20 18 16 14
1.50 1.25 1.00 0.75 0.50 0.25
VFP(V)
IF=IF(AV) Tj=125C
IRM and S factor
12 10
QRR
8 6 4 2
Tj(C)
0.00 25 50 75 100 125
dIF/dt(A/s)
0 100 200 300 400 500
0
Figure 11. Forward recovery time versus dIF/dt (typical values)
tfr(ns)
IF=IF(AV) VFR=1.1 x VF max. Tj=125C
Figure 12. Junction capacitance versus reverse voltage applied (typical values)
100
C(pF)
F=1MHz VOSC=30mVRMS Tj=25C
220 200 180 160 140 120 100 80 60 40 20 0
10
dIF/dt(A/s)
1 0 100 200 300 400 500 1 10
VR(V)
100 1000
Figure 13. Thermal resistance junction to ambient versus copper surface under tab (printed circuit board FR4, eCU = 35 m)
100 90 80 70 60 50 40 30 20 10 0 0 5 10 15 20 25 30 35 40
Rth(j-a)(C/W)
DPAK
S(Cu)(cm)
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STTH506
Package mechanical data
2
Package mechanical data
Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.80 Nm Maximum torque value: 1.0 Nm Table 5. DPAK Dimensions
Dimensions Ref. Millimeters Min.
E B2 C2 L2 A
Inches Min. 0.086 0.035 0.001 0.025 0.204 0.017 0.018 0.236 0.251 0.173 0.368 Max. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.259 0.181 0.397
Max 2.40 1.10 0.23 0.90 5.40 0.60 0.60 6.20 6.60 4.60 10.10
A A1 A2 B
D
2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 6.40 4.40 9.35
B2 C C2
H L4 B G A1
R
R C
D E G
A2 0.60 MIN.
H L2
V2
0.80 typ. 0.60 0 1.00 8
0.031 typ. 0.023 0 0.039 8
L4 V2
Figure 14. DPAK Footprint dimensions (in mm)
6.7 3 3 1.6
2.3 6.7 2.3
1.6
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Package mechanical data Table 6. TO-220AC Dimensions
Dimensions Ref. Millimeters Min.
H2 OI L5 L7 L6 L2 C A
STTH506
Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.194 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.202 0.409
Max. 4.60 1.32 2.72 0.70 0.88 1.70 5.15 10.40
A C D E F F1 G
4.40 1.23 2.40 0.49 0.61 1.14 4.95 10.00
F1
L9 L4 F
D
H2 L2 L4
M E
16.40 typ. 13.00 2.65 15.25 6.20 3.50 14.00 2.95 15.75 6.60 3.93
0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154
L5 L6 L7 L9 M Diam. I
G
2.6 typ. 3.75 3.85
0.102 typ. 0.147 0.151
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STTH506 Table 7. TO-220FPAC Dimensions
Package mechanical data
Dimensions Ref. Millimeters Min. A B
A H B
Inches Min. 0.173 0.098 0.098 0.018 0.030 0.045 0.195 0.094 0.393 Max. 0.181 0.106 0.108 0.027 0.039 0.067 0.205 0.106 0.409
Max. 4.6 2.7 2.75 0.70 1 1.70 5.20 2.7 10.4
4.4 2.5 2.5 0.45 0.75 1.15 4.95 2.4 10
D E
Dia L6 L2 L3 L5 F1 L4 D L7
F F1 G G1 H L2
16 Typ. 28.6 9.8 2.9 15.9 9.00 3.00 30.6 10.6 3.6 16.4 9.30 3.20
0.63 Typ. 1.126 0.386 0.114 0.626 0.354 0.118 1.205 0.417 0.142 0.646 0.366 0.126
F G1 G
E
L3 L4 L5 L6 L7 Dia.
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
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Ordering information
STTH506
3
Ordering information
Delivery mode Tube Tape and reel Tube Tube
Part Number STTH506B STTH506B-TR STTH506D STTH506FP
Marking STTH506B STTH506B STTH506D STTH506FP
Package DPAK DPAK TO-220AC TO-220FPAC
Weight 0.3 g 0.3 g 1.86 1.8 g
Base qty 75 2500 50 50
4
Revision history
Date 18-May-2006 Revision 1 First issue. Description of Changes
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STTH506
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